Construct circuits, packaging, and complete systems
Issues Involved or Addressed
With the rise of lower cost manufacturing capabilities such as 3D printing, there are numerous opportunities to build and create new packaged systems that can perform various useful tasks. This ongoing project is open-ended in that it is looking at the overall design space available with these tools and ways in which to improve or expand the synergies between different additive and subtractive processes. There is a growing need to be able to quickly develop methods to achieving a desired goal. Several example systems will be designed, developed, fabricated, and iterated upon so as to study how these low-cost technologies can be readily applied to different challenges, what degree simulation and modeling can play in this process, and how this technology can improve STEM education.